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november 2016 docid030008 rev 1 1 / 13 this is information on a product in full production. www.st.com ecmf4 - 2450a17m10 common mode filter with esd protection for high speed serial interface datasheet - production data features ? high differential mode attenuation on wlan frequencies : ? - 23 db at 2.4 ghz and - 32 db at 5.0 ghz ? large bandwidth : 1.7 ghz ? very low pcb space consumption. ? thin package: 0.55 mm max. ? lead - free package. ? high reduction of paras itic elements through integration. applications ? set top box ? streaming box ? hdmi stick ? game console ? notebook, laptop ? portable devices description the ecmf4 - 2450a17m10 is a highly integrate d common mode filter and low pass filter designed to suppress wifi differential and common mode noise on high speed differential serial buses like hdmi. the device can protect and filter 2 differential lanes. figure 1 : pin configuration 1 2 4 5 1 0 9 7 6 3 8 d 1 + d 1 - d 1 + d 1 - d 2 + d 2 - d 2 + d 2 - g n d g n d q f n - 1 0 l 2 . 6 0 x 1 . 3 5 m m
characteristics ecmf4 - 2450a17m10 2 / 13 docid030008 rev 1 1 characteristics table 1: absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000 - 4 - 2: contact discharge (connector side) air discharge (connector side) 8 15 kv i rms maximum rms current 100 ma t op operating temperature - 40 to +85 c t j maximum junction temperature 125 t stg storage temperature range - 55 to +150 figure 2 : electrical characteristics (definitions) table 2: electrical characteristics (t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 4.5 5.5 v i rm v rm = 3 v per line 100 na r dc dc serial resistance 5.5 f c - 3 db differential mode cut - off frequency 1.7 ghz v cl i pp = 1 a, 8/20 s 10 v iec 61000 4 - 2, +8 kv contact (i pp = 16 a), measured at 30 ns 12.9 c diode [d+ or d - ]/ gnd v d+/d - = 0 v, f = 2.5 ghz to 6 ghz 0.35 0.45 pf r d dynamic resistance, t p = 100 ns d+ or d - to gnd 0.48 gnd to d+ or d - 0.96
ecmf4 - 2450a17m10 characteristics docid030008 rev 1 3 / 13 table 3: pin description pin number description pin number description 1 d1+ (to connector) 6 d2 - (to ic) 2 d1 - (to connector) 7 d2+ (to ic) 3 gnd 8 gnd 4 d2+(to connector) 9 d1 - (to ic) 5 d2 - (to connector) 10 d1+ (to ic)
characteristi cs ecmf4 - 2450a17m10 4 / 13 docid030008 rev 1 1.1 characteristics (curves) figure 3 : differential attenuation versus frequency (z 0 diff = 100 ?) C evaluation board with sma connector figure 4 : common mode attenuation versus frequency (z 0 com = 50 ?) figure 5 : esd response to iec61000 - 4 - 2 (+8 kv contact discharge)
ecmf4 - 2450a17m10 characteristics docid030008 rev 1 5 / 13 figure 6 : esd response to iec61000 - 4 - 2 ( - 8 kv contact discharge) figure 7 : hdmi1.4 2.228 gbps source eye diagram (without ecmf4 - 2450a17m10) figure 8 : hdmi1.4 2.228 gbps source eye diagram (with ecmf4 - 2450a17m10) figure 9 : hdmi1.4 1.485 gbps source eye diagram (without ecmf4 - 2450a17m10) figure 10 : hdmi1.4 1.485 gbps source eye diagram (with ecmf4 - 2450a17m10)
application information ecmf4 - 2450a17m10 6 / 13 docid030008 rev 1 2 application information figure 11 : hdmi schematic d 0 d 1 e c m f 4 - 2 4 5 0 a 1 7 m 1 0 e c m f 4 - 2 4 5 0 a 1 7 m 1 0 h d m i 2 c 1 - 6 c 1 h d m i a s i c h d m i c o n n e c t o r d 2 c l k
ecmf4 - 2450a17m10 package information docid030008 rev 1 7 / 13 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 3.1 qfn10l package information figure 12 : qfn10l package outline table 4: qfn10l package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 2.55 2.60 2.65 0.1 0.102 0.104 e 1.30 1.35 1.40 0.051 0.053 0.055 e 0.50 0.020 l 0.40 0.50 0.60 0.016 0.020 0.024
package information ecmf4 - 2450a17m10 8 / 13 docid030008 rev 1 figure 13 : footprint recommendations, dimensions in mm (inches) figure 14 : marking layout product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 15 : package orientation in reel figure 16 : tape and reel orientation figure 17 : reel dimensions in mm figure 18 : inner box dimension definition in mm m e 0 . 2 0 0 . 5 0 0 . 0 7 1 . 7 5
ecmf4 - 2450a17m10 package information docid030008 rev 1 9 / 13 figure 19 : tape dimension definitions table 5: tape and reel mechanical data ref. dimensions millimeters min. typ. max. p1 3.9 4.0 4.1 p0 4.0 ? d0 1.4 1.5 1.6 ? d1 1 f 3.45 3.5 3.55 k0 0.6 0.7 0.8 p2 1.95 2 2.05 w 7.9 8 8.3
recommendation on pcb assembly ecmf4 - 2450a17m10 10 / 13 docid030008 rev 1 4 recommendation on pcb assembly 4.1 solder paste 1. halide - free flux qualification rol0 according to ansi/j - std - 004. 2. no clean solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20 - 45 m. 4.2 placement 1. manual positioning is not recommended. 2. it is recomme nded to use the lead recognition capabilities of the placement system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause s older joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.3 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any t ilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
ecmf4 - 2450a17m10 recommendation on pcb assembly docid030008 rev 1 11 / 13 4.4 reflow profile figure 20 : st ecopack ? recommended soldering reflow profile for pcb mounting minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j - std - 020.
ordering information ecmf4 - 2450a17m10 12 / 13 docid030008 rev 1 5 ordering information figure 21 : ordering information scheme table 6: ordering information order code marking package weight base qty. delivery mode ecmf4 - 2450a17m10 me qfn - 10l 5 mg 3000 tape and reel 6 revision history table 7: document revision history date revision changes 08 - nov - 2016 1 initial release. e c m f 4 C 2 4 5 0 a 1 7 m 1 0 f u n c t i o n c o m m o n m o d e f i l t e r w i t h e s d p r o t e c t i o n n u m b e r o f l i n e s 4 = 4 f i l t e r e d l i n e s w i t h e s d p r o t e c t i o n 1 s t c o m m o n m o d e r e j e c t i o n 2 4 = 2 . 4 g h z v e r s i o n a = 1 s t v e r s i o n p a c k a g e m 1 0 : q f n - 1 0 l 2 n d c o m m o n m o d e r e j e c t i o n 5 0 = 5 . 0 g h z d i f f e r e n t i a l b a n d w i d t h 1 7 = 1 . 7 g h z
ecmf4 - 2450a17m10 docid030008 rev 1 13 / 13 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, enhancements, modifications , and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of or der acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and s t assumes no liability for application assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information se t forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2016 stmicroelectronics C all rights reserved

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